CTIA wrap up 1

CTIA: in echo to the CeBIT, high-speed wireless and convergence were at the center of hot topics. Nokia introduced its I-HSPA (Internet High Speed Packet Access) and HSUPA (High Speed Uplink Packet Access) solutions, both aimed at improving data speeds. Nortel unveiled plans for its CDMA2000 1xEV-DO Revision A technology, and Samsung, LG, Siemens, Lucent and Qualcomm also displayed their HSDPA solution.

Ericsson demonstrated its IP Multimedia Subsystem (IMS) solution showing converged GSM/WCDMA/CDMA2000, wireline and WLAN services. Alcatel introduced its new CDMA complete solution. Lucent unveiled its Super-Distributed Home Location Register enhanced version, as well as its Market Advantage Program (MAP) for Application Partners. Motorola announced its WiMAX platform. Siemens showed the first public demonstrations of the Siemens HiPath OpenScape collaboration portal, with its Internet Protocol-based Multimedia Subsystem (IMS) platform, Siemens IMS@dvantage.

UTStarcom showed its complete wireless solutions, including both infrastructure and handsets, for Personal Access System (PAS), CDMA, and 3G networks. It introduced the CDM-7000 and CDM-9200 Series CDMA mobile handsets. It also introduced the CDMA2000 IP distributed solution for NGN.

Samsung released the world's first 7-megapixel camera phone, its new p777, a high-speed, high-bandwidth, multimedia tri-band phone. It also introduced the Model 1895, a GSM tri-band 900/1800/1900 MHz with multimedia features, the Model 1893 (a multimedia phone for mass and emerging markets), the Model 1813, the Model 1872 and Models 1809 and 1811 (GSM tri-band phones).